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  • 8/17/2019 Cu Cu2O particles from Cu(acac)2.pdf

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    See discussions, stats, and author profiles for this publication at: https://www.researchgate.net/publication/226334416

    Copper and Copper Oxide NanoparticleFormation by Chemical Vapor Nucleation From

    Copper (II) Acetylacetonate

     ARTICLE  in  JOURNAL OF NANOPARTICLE RESEARCH · NOVEMBER 2001

    Impact Factor: 2.18 · DOI: 10.1023/A:1012508407420

    CITATIONS

    62

    READS

    213

    5 AUTHORS, INCLUDING:

    Albert G Nasibulin

    Skolkovo Institute of Science and Technology

    241 PUBLICATIONS  3,991 CITATIONS 

    SEE PROFILE

    Igor Altman

    49 PUBLICATIONS  526 CITATIONS 

    SEE PROFILE

    All in-text references underlined in blue are linked to publications on ResearchGate,

    letting you access and read them immediately.

    Available from: Albert G Nasibulin

    Retrieved on: 06 March 2016

    https://www.researchgate.net/?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_1https://www.researchgate.net/profile/Igor_Altman?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_7https://www.researchgate.net/profile/Igor_Altman?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_5https://www.researchgate.net/profile/Igor_Altman?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_4https://www.researchgate.net/profile/Albert_Nasibulin?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_7https://www.researchgate.net/institution/Skolkovo_Institute_of_Science_and_Technology?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_6https://www.researchgate.net/profile/Albert_Nasibulin?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_5https://www.researchgate.net/profile/Albert_Nasibulin?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_4https://www.researchgate.net/?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_1https://www.researchgate.net/publication/226334416_Copper_and_Copper_Oxide_Nanoparticle_Formation_by_Chemical_Vapor_Nucleation_From_Copper_II_Acetylacetonate?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_3https://www.researchgate.net/publication/226334416_Copper_and_Copper_Oxide_Nanoparticle_Formation_by_Chemical_Vapor_Nucleation_From_Copper_II_Acetylacetonate?enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2&el=1_x_2

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     Journal of Nanoparticle Research 3:  385–400, 2001.© 2001 Kluwer Academic Publishers. Printed in the Netherlands .

    Copper and copper oxide nanoparticle formation by chemical vapornucleation from copper (II) acetylacetonate

    Albert G. Nasibulin1, P. Petri Ahonen1, Olivier Richard1, Esko I. Kauppinen1,∗  and Igor S. Altman21VTT Chemical Technology, Aerosol Technology Group, P.O. Box 1401, FIN-02044 VTT, Finland;2 Institute of Combustion & Advanced Technologies, Odessa National University, Dvoryanskaya 2,

    Odessa, 65026, Ukraine; ∗ Author for correspondence (Tel.:+358 9 456 6165; Fax:+358 9 456 7021; E-mail: [email protected])

    Received 22 January 2001; accepted in revised form 20 June 2001

    Key words: Cu, Cu2O, nanoparticle, copper acetylacetonate, thermal vapor decomposition, chemical nucleation

    Abstract

    Crystalline nanometer-size copper and copper (I) oxide particle formation was studied by thermal decomposition of 

    copper acetylacetonate Cu(acac)2 vapor using a vertical flow reactor at ambient nitrogen pressure. The experiments

    were performed in the precursor vapor pressure range of  P prec = 0.06 to 44 Pa at furnace temperatures of 431.5◦C,596.0◦C, and 705.0◦C. Agglomerates of primary particles were formed at  P prec  >   0.1 Pa at all temperatures. At431.5◦C the number mean size of the primary particles increased from  Dp =   3.7 nm (with geometric standarddeviation σ g

     =1.42) to Dp

     =7.2 nm (σ g

     =1.33) with the increasing precursor vapor particle pressure from 1.8 to

    16 Pa. At 705.0◦C the primary particle size decreased from Dp = 24.0 nm (σ g = 1.57) to Dp = 7.6 nm (σ g = 1.54),respectively.

    At furnace temperatures of 431.5◦C and 596.0◦C only crystalline copper particles were produced. At 705.0◦C thecrystalline product of the decomposition depended on the precursor vapor pressure: copper particles were formed

    at  P prec  >  10 Pa, copper (I) oxide at P prec ≤  1 Pa, and a mixture of the metal and its oxide at intermediate vaporpressures. A kinetic restriction on copper particle growth was shown, which leads to the main role of Cu 2 molecule

    participation in the particle formation. The formation of copper (I) oxide particles occurs due to the surface reaction

    of the decomposition products (mainly carbon dioxide). For the explanation of the experimental results, a model is

    proposed to build a semiempirical phase diagram of the precursor decomposition products.

    Introduction

    Copper and copper oxide particles are of significanttechnological interest. Applications for copper pow-

    der include bronze self-lubricating bearings, conduc-

    tive epoxys, metal-bonded abrasive wheels and cutting

    tools, and braking systems. Ultra-fine copper particles

    are a base for developing technologies such as metal

    injection molding as well as for electronics, ceram-

    ics and for thick/thin-film applications. Copper oxides

    have applications in thin-film oxygen pressure sensors,

    as a binder in pastes for thick-film microelectronic

    circuits, as a p-type semiconductor and they exhibit

    luminescence (Majumdar et al., 1996; Holzschuh &

    Suhr, 1990).The importance of producing copper and copper

    oxide particles is exemplified by applications such as

    high surface area catalysts that are used in diverse

    chemical processes, for example, the water-gas shift

    reaction (Campbell et al., 1987),  the butanol dehydro-

    genation reaction (Shiau & Tsai, 1997) and the car-

    bon monoxide oxidation (Van der Meijden, 1981; Du

    et al., 1997). Copper-based catalysts are used as a key

    intermediate in the industrial synthesis of methanol

    https://www.researchgate.net/publication/223211557_CuZnO0001_and_ZnOxCu111_Model_catalysts_for_methanol_synthesis?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/223211557_CuZnO0001_and_ZnOxCu111_Model_catalysts_for_methanol_synthesis?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2

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    386

    (Klier, 1982; Campbell et al., 1987; Yurieva et al.,

    1993; Klenov et al., 1998), which is promising as

    an environmentally friendly fuel for the power indus-

    try. In addition, copper and copper-based materials

    have applications as catalysts in traditional and new

    organic syntheses, for example, the condensation of 

    aromatic halides, known as Ullmann reaction (Dhas

    et al., 1998), synthesis of cyclic amines from amino-

    alcohols and their alkyl derivatives (Hammerschmidt

    et al., 1986; Kijenski et al., 1989), synthesis of methy-

    lamines (Gredig et al., 1997), thermal cracking of plas-

    tics and many others (Kijenski et al., 1984; Runeberg

    et al., 1985; Vultier et al., 1987; Pereia et al., 1994;

    Shannon et al., 1996). Copper has been also identi-

    fied as a good catalyst for the combustion of methane

    (Tijburg, 1989) and selective oxidation of hydrocar-

    bons (Adams & Jennings, 1964; Voge & Adams,

    1967).

    Thus, studies of the formation of copper and cop-

    per oxide particles are important. Accordingly, it has

    been a subject of much research during thelast decades.

    Copper and copper oxide particle formation have

    been studied by solution reaction: reduction of cop-

    per (II) acetate in ethanol (Ayaappan et al., 1997)

    and in water and 2-ethoxyethanol using hydrazine

    (Huang et al., 1997),   the reaction of copper (II)

    chloride with organolithium compounds (Takahashi

    et al., 1988), reduction of copper dodecylsulfate bysodium borohydrate (Lisieski et al., 1996),   by using

    reverse micelles   (Lisieski & Pileni, 1993; 1995),

    thermal and sonochemical reductions of copper (II)

    hydrazine carboxylate (Dhas et al., 1998), chem-

    ical deposition in two-phase system octane–water

    (Vorobyova et al., 1997), by means of electrolysis

    (Folmanis & Uglov, 1991; Kirchheim et al., 1991;

    Pietrikova & Kapusanska, 1991) and others (Herley

    et al., 1989). Ding et al. (1996) prepared copper

    nanoparticles by a mechanochemical process and

    studied the influence of milling conditions on par-

    ticle structure and size. Nanocrystalline copper was

    prepared by consolidation of mechanically milledpowder by   Weins et al. (1997).   Copper oxide for-

    mation was studied via oxidation of copper par-

    ticles (Kaito et al., 1973; 1993; Kellerson et al.,

    1995).

    Much work has been devoted to the investigation of 

    aerosol formation of copper or its oxide particles by

    physical methods, including molecular beams (Bowles

    et al., 1981), direct laser vaporization (Moini andEyler,

    1988), by using gas evaporation (Kashu et al., 1974;

    Peoples et al., 1988; Xu et al., 1992), sputtering

    (Haas & Birringer, 1992), melting in a cryogenic

    liquid (Champion & Bigot, 1996) and others (Long

    & Petford-Long, 1986; Girardin & Maurer, 1990;

    Bouland et al., 1992).Another anda very attractive way

    to obtain aerosol particles is via the chemical route.

    This method might be the least expensive for aerosol

    particle formation under controlled conditions. Little

    work has been devoted to copper and its oxide for-

    mation by chemical vapor nucleation. Majumdar et al.

    (1996) generated CuO powder by spray-pyrolysis from

    Cu(NO3)2   solution. Daroczi et al. (1998)   studied the

    production of copper and iron nanocomposites by ther-

    mal decomposition of copper–ferrocyanide in an open

    vertical tube. The obvious advantage of the chemical

    vapor nucleation method is the possibility to produce

    nanosized particles at relatively low temperatures and

    ambient pressure.

    The current work is devoted to the investigation

    of copper and copper oxide particle formation from

    metal–organic compound, copper (II) acetylacetonate

    (Cu(acac)2). A suitable equilibrium vapor pressure

    (P   =   13.1Pa at   t   =   150.0◦C) and a convenientdecomposition temperature (t dec  =   286◦C) were thereasons for the choice of this precursor. The selection

    of this metal–organic substance was also based on its

    popularity as a precursor for chemical vapor deposi-

    tion processes (e.g., Pelletier et al., 1991; Pauleau &Fasasi, 1991; Gerfin et al., 1993; Marzouk et al., 1994;

    Hammadi et al., 1995; Maruyama & Shirai, 1995) and

    on the knowledge of decomposition reaction kinetics

    (Tsyganova et al., 1992). The goals of the investigation

    are to produce copper and/or copper oxide nanoparti-

    cles at ambient pressure and at a temperature as low

    as possible, to characterize the obtained nanoparticles

    synthesized with various reactor conditions, and to

    discuss nanoparticle formation based on experimental

    results.

    Experimental

     Materials

    For this study copper (II) acetylacetonate, Cu(acac)2,

    (Aldrich Chemical Company, 97%) has been used as

    a precursor. The decomposition of Cu(acac)2   vapor

    leads to the formation of copper vapor that is supersat-

    urated at the experimental conditions. The Cu(acac)2

    https://www.researchgate.net/publication/231678344_Synthesis_Characterization_and_Nonlinear_Optical_Properties_of_Copper_Nanoparticles?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/231655678_Control_of_the_Shape_and_the_Size_of_Copper_Metallic_Particles?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/231435324_Synthesis_of_Copper_Metallic_Clusters_Using_Reverse_Micelles_as_Microreactors?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/248543000_Low-frequency_internal_friction_studies_of_nanocrystalline_copper?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/250337194_Production_of_Fe_and_Cu_Nanocrystalline_Particles_by_Thermal_Decomposition_of_Ferr-_and_Copper-Cyanides?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/231435324_Synthesis_of_Copper_Metallic_Clusters_Using_Reverse_Micelles_as_Microreactors?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/231678344_Synthesis_Characterization_and_Nonlinear_Optical_Properties_of_Copper_Nanoparticles?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/231655678_Control_of_the_Shape_and_the_Size_of_Copper_Metallic_Particles?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/248543000_Low-frequency_internal_friction_studies_of_nanocrystalline_copper?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/250337194_Production_of_Fe_and_Cu_Nanocrystalline_Particles_by_Thermal_Decomposition_of_Ferr-_and_Copper-Cyanides?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2

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    387

    decomposition reaction can be presented as

    CH3

    HC Cu CH

    CH3 CH3

    CH3

    O O

    O O  ∆T 

    38.0

    Cu+CuO+H2C CH2(CO)

    36.0 22.3

    O

    + CO2 + H3C C CH3

    3.2 0.3

    O

    + H2O + H3C C C2H5, (1)

    where numbers below the decomposition reaction

    products indicate molar percentage fraction of thegaseous reaction products which were measured using

    mass-spectrometry analysis by Tsyganova et al. (1992).

    Such reaction products indicate significant destruc-

    tion of the ligand, acetylacetone, which is possibly

    formed on the initial stage of the thermal decomposi-

    tion. The Cu(acac)2  vapor decomposition was studied

    using the manometric method in static conditions in

    clear ampoules at 290–335◦C and at initial pressures of 98–173 hPa (Tsyganova et al., 1992).

    In our study two sources of nitrogen (AGA,

    99.9 vol.% and 99.999 vol.%) have been used as a

    carrier gases. Inert nitrogen was used in order to pre-

    vent the additional reoxidation of the formed cop-

    per vapor by atmospheric oxygen. The compaction of 

    Cu(acac)2 powder in a saturatorand hence,blockingthe

    flow were prevented by mixing the powder with inert

    chromatographic carrier, silicon dioxide, SiO2 (Balzers

    Materials, 99.9%) with a grain size of 0.2–0.7 mm.

     Experimental methods

    A vertical laminar flow reactor for experimental inves-

    tigation of Cu(acac)2  decomposition under controlled

    conditions was designed and constructed (Figure 1).

    The experimental device consistedof a saturator,a lam-inator, and a furnace. The saturator and the lamina-

    tor consisted of a stainless steel tube with an internal

    diameter of 22 mm. A removable cartridge, to hold the

    mixture of Cu(acac)2 powder and the chromatographic

    carrier, was inserted inside the tube. An absolute filter

    (Munktell, MK 360) was used to clean the vapor–gas

    flow downstream of the saturator. The saturation mix-

    ture and the filter were retained on a stainless steel net.

    In order to laminarize the flow and to avoid turbulence

    of the flow proceeding from small diameter to large

    one after the saturator a laminator has been used. It was

    constructed as a cylindrical cone in the junction part.

    Between the laminator and the furnace, a Teflon ther-

    moinsulator was used. A ceramic tube, with external

    and internal diameters of 28 and 22 mm, respectively,

    inserted inside the furnace (Entech, Sweden) has been

    used as a reactor.

    The flow of pure filtered nitrogen carrier gas was

    supplied from a high-pressure cylinder to the satura-

    tor. Then the gas passed through the heated Cu(acac) 2powder and the vapor saturation by the precursor was

    reached. Inside the laminator, a steady state lami-

    nar flow was established. Then the vapor–gas mix-

    ture entered to the furnace where the temperature

    is maintained higher than the Cu(acac)2   decompo-

    sition temperature. The formation of supersaturated

    copper vapor, as a result of the precursor decomposi-

    tion reaction, led to the nucleation process and further

    growth of particles via condensation, coalescence, and

    agglomeration processes.

    The flow rate of the gas-carrier was measured by

    a flow meter (DC-2, BIOS) and was referred to the

    standard condition (t   =   25◦C,   P   =   101325 Pa).Temperatures were measured by nichrome–nickelther-

    mocouples (K-type) which had been calibrated with an

    accuracy of 0.1◦C by using an oil bath and thermoresis-

    tors calibrated against the Finnish National Standard.The aerosol number size distributions in the range of 

    3–200 nm were measured by a differential mobility

    analyzer (DMA) system consisting of a charger, a clas-

    sifier (Winklmayr et al., 1991, modified Hauke, length

    of 11 cm), a condensation particle counter (CPC, TSI

    3027), and a supporting software. A sheath flow rate

    for DMA system was maintained at  Qsh =   14.5 lpm.The morphology, the primary particle size, and the

    crystallinity of the particles were investigated with

    a field emission scanning electron microscope (Leo

    Gemini DSM982) and a field emission transmission

    electron microscope (Philips CM200 FEG), respec-

    tively. An electrostatic precipitator (Combination elec-trostatic precipitator, InTox Products, Albuquerque,

    NM, USA) was used to collect the aerosol particles

    on a carbon-coated copper grid (SPI Holey Carbon

    Grid). Electron diffraction patterns of the particles

    were used for determination of the crystalline phase.

    The samples for X-ray diffraction (XRD, Philips MPD

    1880 powder X-ray diffractometer) spectrometry were

    collected on silver filter disks (Millpore AG4502500,

    45 µ m pore) and studied with Cu Kα   (λ =  0.154 nm)

    https://www.researchgate.net/publication/222309681_A_New_Electromobility_Spectrometer_for_the_Measurement_of_Aerosol_Size_Distribution_in_the_Size_Range_From_1_to_1000?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/222309681_A_New_Electromobility_Spectrometer_for_the_Measurement_of_Aerosol_Size_Distribution_in_the_Size_Range_From_1_to_1000?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2

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    388

    Figure 1. Schematic presentation of the experimental setup.

    radiation. A Mettler Toledo TA8000 system equipped

    with TGA850 thermobalance was used for thermo-

    gravimetric analysis (TGA) of the samples under

    flowing nitrogen atmosphere with the heating rate of 

    10◦C/min for sample sizes of approximately 3 mg.Inside the reactor a known temperature gradient

    was maintained, which gives the possibility to deter-

    mine the location where the decomposition of the pre-

    cursor occurs. Tsyganova et al. (1992) reported that

    the Cu(acac)2  vapor decomposition was a first-order

    rate reaction. The rate constant of this reaction can

    be calculated by using the Arrhenius equation   k  =k0 exp (−Ea/RT), where the pre-exponential factor isk0   =   3.02×107 s−1, the activation energy is   Ea   =115.4 kJ/mole, andR is the universal gas constant. It is

    obvious that most of the copper acetylacetonate vapor

    thermolysis occurs in the vicinity of the highest tem-

    perature zone in the furnace. In Figure 2 the depen-

    dence of temperature and the rate constant of Cu(acac)2decomposition reaction inside the reactor are shown.

    On the basis of data presented in Figure 2, the decom-

    position of the metal–organic precursor occurs at loca-

    tion   x  =   255 ±   12 mm, and at the temperature of t  = 431.5± 0.5◦C.

    Determination of Cu(acac)2vapor concentration

    It is known that the vaporization rate of the solid

    precursor changes with time due to decreasing sur-

    face area of the powder   (Chou & Tsai, 1994;

    https://www.researchgate.net/publication/256362839_Dynamic_evaporation_behaviour_of_diketonate_compounds_of_yttrium_copper_and_barium?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2https://www.researchgate.net/publication/256362839_Dynamic_evaporation_behaviour_of_diketonate_compounds_of_yttrium_copper_and_barium?el=1_x_8&enrichId=rgreq-bf4c1784-6c58-4384-a595-ed7c6d8c135e&enrichSource=Y292ZXJQYWdlOzIyNjMzNDQxNjtBUzo5NzAzNTkxMDkwOTk1NkAxNDAwMTQ2NTcyNDI2

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    Figure 2. The dependence of temperature and the rate constant of Cu(acac)2  decomposition reaction inside the reactor.

    Figure 3. The dependence of the evaporation rate at different conditions.

    Kodas & Hampden-Smith, 1999). Certainly, the vapor

    pressure of the precursor is a crucial factor in the

    decomposition reaction. It can be a reason for the irre-

    producibility of the experimental results and, as it will

    be found out later, it is even the reason for a change of 

    decomposition reaction products. Therefore, studies of 

    gas flow saturation by Cu(acac)2 vapor are necessary.

    The usage of the removable cartridge (Figure 1)

    allows determining of the saturation degree of the car-

    rier gas flow by Cu(acac)2   vapor. If the flow rate of 

    the gas and the mass difference of the cartridge with

    Cu(acac)2 powder in a certain time interval are known,

    it is possible to calculatethe evaporationrate andhence,

    the vapor pressure of the metal–organic compound at

    the entrance of the reactor. From Figure 3 it can be seen

    that the evaporation rate decreases with experimental

    time. The gas saturation by Cu(acac)2 vapor decreases

    very rapidly at a saturatortemperatureof t sat = 190.0◦Cand at a flow rate of  Q =   2000 cm3 /min. Because of high gas velocity, the saturation time is too short to heat

    the carrier gas in the upper part of the saturator. The

    observation of saturator mixture color showed that the

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    precursor was consumed in the lower part where gas

    temperature reached the saturator temperature. At the

    flow rate of  Q =   330 cm3 /min and at   t sat =   170◦C,the evaporation decreases less rapidly and depends on

    the decrease of the powder surface area. Decreasing

    the saturator temperature down to 150◦C leads to thesignificant decrease of the evaporation rate dependence

    on time. Four days of continuous operation using the

    flow rate of  Q =   330 cm3 /min revealed that a signif-icant change in the results (concentration and number

    size distribution of agglomerated particles) was found

    only after the first 24 h period.

    The effect of the composition of the copper acety-

    lacetonate and silicon dioxide mixture on the evapora-

    tion rate was also investigated. Variation of the mass

    ratio of Cu(acac)2   and SiO2   from 1:3 to 1:150 did

    not significantly affect on the precursor vapor pres-

    sure at the entrance to the reactor. The influence of 

    using a small precursor fraction (1 : 150 relation) was

    found only after about 7 h because of the exhaustion

    of Cu(acac)2   material, while duration of an experi-

    ment was only about 30–40 min. During the follow-

    ing experiments only newly prepared powder mixtures

    consistingof 4 g (1.53×10−2 mole) of copper(II) acety-lacetonate and 16 g (0.27 mole) of silicon dioxide have

    been used as the saturator mixture.

    The dependence of vapor pressure, as determined

    from the cartridge mass difference, on the satura-tor temperature at  Q =   330 cm3 /min is presented inFigure 4. Also, a fitted curve and literature data of 

    Figure 4. The dependence of the precursor vapor pressure on the saturator temperature.

    Cu(acac)2   equilibrium vapor pressure (Teghil et al.,

    1981; Tonneau et al., 1995) are shown. From the figure,

    a difference between the literature data and our results

    can be seen. It is necessary to note that the measured

    saturator temperature does not coincide with the pow-

    der temperature inside the saturator and has been used

    only as a reference temperatureduring the experiments.

    The main crucial experimental parameter is the pre-

    cursor concentration, which has been determined after

    each experiment. Thus, during our experiments, well-

    controlled parameters of the setup regarding the con-

    tents of vapor–gas phase have been maintained.

    Results and discussion

     Experimental results

    Experiments on particle formation were carried out at

    two fixed temperature profiles inside the furnace. One

    of these profiles is shown in Figure 2. Experiments

    were also performed with a similar temperature profile

    with a temperature maximum at   t  =   705.0 ± 0.5◦C,where this condition was valid at  x  =   255 ± 15 mm.In the following section, we refer to those temperature

    profiles as 431.5◦C and 705.0◦C.First, experiments on the influence of residence

    time (flow rate) on particle number size distribu-tions were carried out. At the furnace temperature of 

    t furn = 431.5◦C, at flow rates higher than 400 cm3 /min,

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    Figure 5. Number particle size distributions at the different flow rates.

    a bimodal particle size distribution was measured

    (Figure 5). SEM and TEM micrographs showed two

    kindsof particles – smallagglomerated copper particles

    and needle-like particles of Cu(acac)2. Thus, the mode

    with the smaller mean size is connected to copper par-

    ticle formation and the second one is due to nucleationof undecomposed Cu(acac)2 vapors downstream of the

    furnace. The variation of the flow rates at the furnace

    temperature of 705.0◦C showed that the optimum flowratewasabout330 cm3 /min. The choice of this flow rate

    was determined by the concentration range of the con-

    densation particle counter (1–105 particles/cm3)andby

    reasonable time of a sample collection for XRD anal-

    ysis. Hereafter, only experimental results obtained at

    the flow rate of  Q = 330 cm3 /min are presented.TEM micrographs of the nanoparticles synthesized

    at reactor temperature of 431.5◦C and at the precur-sor vapor pressures of  P prec

     =  1.8 and  P prec

     =  16Pa

    are presented in Figure 6. As one can see, the primaryaerosol particles are fairly monodisperse and the size

    of the particles increases with increasing saturator tem-

    perature. In the same figure, the electron diffraction

    patterns of the agglomerated particles are presented.

    The electron diffraction ring pattern simulations per-

    formed for copper fits with the experimental results.

    These results have been confirmed by XRD analysis.

    TGAshowed that at thefurnace temperature of 431.5◦Cthe decomposition of the precursor was not complete.

    At the furnace temperature of 431.5◦C only 20% of Cu(acac)2  was thermolyzed. The remaining undecom-

    posed Cu(acac)2 forms a layer around copper particles

    that can be seen on the TEM images (Figure 6). It is

    worth noting that the electron diffraction ring pattern

    enclosed in Figure 6(a) is not so clear as the othersdue to the large amount of amorphous unreacted pre-

    cursor. Microdiffraction patterns for this experimental

    condition have been also performed in order to deter-

    mine unambiguously that the particles presented in

    Figure 6(a) are crystalline copper.

    TEM results for the nanoparticles synthesized

    at 705.0◦C and at the precursor vapor pressures of P prec = 1.8 and P prec = 16 Pa are presented in Figure 7.With these conditions, the size of the primary par-

    ticles decreases with increasing the vapor pressure

    of the precursor, that is, there is an inverse situation

    compared to the preceding samples synthesized at

    the furnace temperature of   t furn =   431.5◦C. Electrondiffraction patterns of the agglomerated particles pro-

    duced at the furnace temperature of   t furn  =   705.0◦Cindicate the presence of crystalline copper particles

    at the vapor pressure of   P prec   =   16 Pa and copperoxide (Cu2O, cuprite) particles at the vapor pressure

    of  P prec =  1.8 Pa. In Figure 8 XRD diffractograms of the particles collected on a silver filter are shown. The

    variation of the crystalline phase with changing the

    precursor vapor pressure can be seen. At the vapor

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    Figure 6 . Transmissionelectron microscopyimages and electron

    diffraction patterns of particles produced at the precursor vapor

    pressure of  P prec =  1.8 Pa (a) and P prec =  16 Pa (b). The furnacetemperature is 431.5◦C.

    pressure of  P prec =  1.8 Pa and P prec =  6 Pa, a mixtureof crystalline copper and copper (I) oxide particles

    was synthesized and at higher saturator temperatures

    only copper particles were formed.

    The additional experiments of XRD phase identi-

    fication were carried out at the intermediate furnace

    temperature of  t furn = 596.0◦C. At the precursor vaporpressures of P prec = 6 and 44 Pa only copper crystallineproduct was found.

    The effect of the experimental conditions on product

    compositions is presented in Table 1. As one can see

    from Table 1, the dependence of the decomposition

    Figure 7 . Transmissionelectron microscopyimages and electron

    diffraction patterns of particles produced at the precursor vapor

    pressure of  P prec =  1.8 Pa (a) and P prec =  16 Pa (b). The furnacetemperature is 705.0◦C.

    product on theprecursor vaporpressureis revealed only

    at highest experimental temperature of t furn =705.0◦C.

    The possible reasons of this phenomenon are examined

    in the discussion part of the article.

    In an attempt to reduce agglomeration, the aerosol

    flow was diluted by excess nitrogen flow immedi-

    ately downstream of the furnace. The particle num-

    ber size distribution was not significantly changed,

    indicating that agglomeration of the particles occurred

    inside the furnace. Another way to avoid the for-

    mation of the agglomerated particles is to decrease

    the number concentration of the primary particles by

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    Figure 8. XRD spectra of particles synthesized at the furnace temperature of 705.0◦C and collected on the silver filter.

    Table 1. List of experimental conditions, corresponding

    crystalline product compositions, and methods used for the

    phase identification

    Furnace Vapor pressure Crystalline Method

    temperature, ◦C of precursor, Pa products

    431.5 0.15–44 Cu XRD, ED

    596.0 6–44 Cu XRD

    705.0 0.06–1.0 Cu2O ED

    705.0 1.8–10 Cu/Cu2O XRD, ED

    705.0 16–44 Cu XRD, ED

    decreasing the Cu(acac)2  vapor pressure. In Figure 9

    and Figure 10 the number size distribution of the

    produced particles at different saturator temperatures

    of  t furn = 431.5◦C and t furn = 705.0◦C are presented. Itis known that the area limited by the curve determines

    the particle number concentration. At t furn =   431.5◦Cthe concentration grows smoothly when the satura-

    tor temperature increases, but at   t furn  =  705.0◦C the

    change of the concentration is not smooth. This is

    probably in connection with the formation of different

    decomposition products.

    At precursor vapor pressures below 0.1 Pa, single

    crystalline individual particles are formed, the forma-

    tion of agglomerated particles is observed at higher

    vapor pressures. In Figure 11, TEM micrograph of 

    copper (I) oxide nanoparticle that was produced at

    the furnace temperature of 705.0◦C and at the vaporpressure of   P prec  =   0.04 Pa is presented. This high

    resolution picture shows the possibility to produce

    single crystalline individual nanoparticles.

    Discussion

    The size distribution of primary particles obtained

    from TEM micrographs is presented in Figure 12. At

    431.5◦C the number mean size of the primary particlesis increased from  Dp =   3.7 (with geometric standarddeviation of  σ g =   1.42) to  Dp =   7.2nm (σ g =   1.33)with increasing precursor vapor pressure from 1.8 to

    16 Pa. At   t furn  =   705.0◦C, the primary particle sizeis decreased from  Dp   =   24.0 n m (σ g   =   1.57) toDp  =   7.6 nm (σ g  =   1.54), respectively. At the fur-nace temperature of   t furn  =   431.5◦C, increasing thevapor pressure increased the size of the primary par-

    ticles, but at  t furn =   705.0◦C an inverse situation wasobserved. Apparently, it is connected with the dif-

    ferent products of the precursor decomposition. The

    diameter of the primary copper (I) oxide particles

    (t furn =   705.0◦C,  P prec =   1.8 Pa) is about three timeslarger than that of the copper particles (t furn = 705.0◦C,P prec =  16 Pa). The qualitative explanation of the pri-mary size dependence on the crystalline products can

    be obtained from the consideration of physical proper-

    ties of these compounds. It is known that the sintering

    rate, which controls the size of primary particles,

    is dependent on the self-diffusion coefficient of the

    elements contained in the substance: with the larger

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    Figure 9. Number size distributions of agglomerated particles at the furnace temperature of  t furn = 431.5◦C.

    Figure 10. Number size distributions of agglomerated particles at the furnace temperature of  t furn = 705.0◦C.

    coefficient the sintering rate is enhanced and the size

    of primary particles becomes larger. According to the

    literature data (Smithells & Brandes, 1983; Kofstad,

    1972), the self-diffusion coefficients of copper atoms

    are 1.9×10−12 cm2 /s in pure crystalline copper and1.5×10−10 cm2 /s in crystalline copper (I) oxide attemperature   t   =   705◦C. The almost two orders of magnitude of difference in the diffusion coefficients

    is most likely the reason for the formation of such a

    different size of copper and copper (I) oxide primary

    particles.

    As it was found, the product of the decomposition

    reaction depended on the precursor vapor pressure only

    at   t furn  =   705.0◦C: copper particles were formed atthe higher vapor pressures (P prec  >   10 Pa), copper (I)

    oxide particles at the pressures of  P prec  <  1 Pa, and a

    mixture of Cu and Cu2O was formed at the interme-

    diate vapor pressures. At the furnace temperatures of 

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    431.5◦C and 596◦C, only copper particles were formed(Table 1). At the first glance, the revealed dependence

    of oxygen content in particles upon the precursor pres-

    sure seems to be anomalous. Indeed the formation of 

    Figure 11. High resolution transmission electron micrograph of 

    Cu2O particle produced at the furnace temperature of 705.0 ◦Cand at the vapor pressure of  P prec = 0.04 Pa.

    Figure 12. Particle number size distributions of primary particles.

    primary particles can be presented by two sequential

    steps. At the first stage, small clusters are formed by

    means of homogeneous nucleation process, and sec-

    ondly, the particles grow because of a coalescence of 

    the clusters and vapor condensation on the particles.

    Increasing the precursor pressure leads to the increase

    of the oxygen-containing gas pressure in the system

    and its participation in these two stages. The presence

    of oxygen in the particles with increasing the precur-

    sor pressure at least cannot vanish. Let us demonstrate

    that this prima facie consideration is incorrect for the

    explanation of the experimental results.

    A few possible reasons for the change of decom-

    position products were examined. The first reason

    could be the presence of impurities in the carrier

    gas. The appearance of the copper (I) oxide in the

    crystalline products occurs at the precursor vapor

    pressure of 10 Pa, which corresponds to a concen-

    tration of 2.6×1015 molecules/cm3. Meanwhile, themaximum concentration of admixtures in the nitrogen

    carrier gas sample is about 2.5×1016 molecules/cm3,that is, the concentration of the main component in

    the reaction is of the same order or less than the

    impurity concentration. In order to check this hypoth-

    esis, the nitrogen gas cylinder was changed to a

    liquid nitrogen tank to obtain ultra-pure carrier gas

    (99.999 vol.% with maximum oxygen concentration

    of 8.1×1013

    molecules/cm3

    ). Decreasing the content of admixtures by two orders of magnitude did not change

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    the product of the Cu(acac)2 decomposition. Moreover,

    the results by Tonneau et al. (1995) and Hammadi et al.

    (1995) on chemical vapor deposition are also contrary

    to this assumption. They showed that when the vapor

    mole fractions of oxygen and Cu(acac)2   were about

    the same, only crystalline copper was formed. Accord-

    ingly, the presence of impurities in the gas-carrier is

    not likely to be the reason for the different products of 

    the reaction.

    Another possible reason is connected with the kinet-

    ics of the decomposition. It is well known that chang-

    ing the gas phase concentration of the reactant can

    lead to the change of the decomposition mechanism

    (Kondrat’ev, 1964). For example, at lower precur-

    sor concentrations a unimolecular decomposition can

    occur and as a result of the decomposition Cu 2O is

    formed. Increasing the vapor pressure leads to the

    increase in the probability of collisions of two or more

    molecules during the Cu(acac)2   thermolysis reaction,

    which leads to the decomposition product of pure

    copper. However, in order to form Cu2O molecule

    it is necessary to have two precursor molecules, but

    for copper formation only one precursor molecule

    is needed. Thus, this explanation is correct for the

    inverse behavior. Moreover, it is hard to believe that

    switching the mechanism from a unimolecular to a col-

    lision reaction can occur in a such small vapor pres-

    sure range. Therefore, the explanation of switching thedecomposition mechanism does not seem to be justi-

    fied for the elucidation of the variation of the reaction

    products.

    Also, a possible reason of the condensed product

    variation may be related to the kinetics of particle

    formation. Then the explanation of the phenomena is

    possible only in the case of any second-order reac-

    tion. Indeed, the ratio of partial pressures of all species

    formed in the first-order reactions is the same at all pre-

    cursor pressures. Thereby, the relative role of different

    gaseous species in the condensed particle growth can-

    not depend on the precursor pressure. The possible rea-

    son for the crystalline product change is the existenceof a secondary reaction. We assume that this reaction

    is a formation of copper dimers that are quite stable at

    the experimental conditions (Petrov, 1986):

    2Cu(g)⇔ Cu2(g).   (2)

    In order to explain the revealed transition between the

    crystalline products let us consider the mechanism of 

    the formation of different condensed substances from

    gas phase in detail.

    It is worth noting that there is a restriction prohibit-

    ing the growth of copper particles from gas via single

    Cu atom adsorption on thecluster surface. Thephysical

    fundamentals of such restrictions for different mate-

    rials are discussed by Altman et al. (2001). They are

    based on the mechanism of energy transfer during a

    phase transition. The energy release during Cu atom

    condensation is about 3.5 eV, and this energy has to

    be dissipated directly during the adsorption. There are

    two possible ways for this process: an electron exci-

    tation and a phonon creation. Since this energy value

    is large compared to a typical Debye energy value

    (0.05 eV), only the electron excitation for energy dis-

    sipation is left. However, the energy band structure of 

    copper contains the sp-band gap (Knoesel et al., 1998).

    The value of the sp-band gap energy at the experimen-

    tal conditions is about 4.6–4.7 eV. The existence of this

    gap leads to impossibility of the direct energy dissi-

    pation from an adsorbing copper atom and to a pro-

    hibition of the atom condensation as a consequence.

    The energy release for Cu2   molecule condensation is

    about 5 eV, which is larger than the copper energy

    gap. Therefore, this process becomes feasible and the

    growth of the particles is made possible by conden-

    sation of Cu2  molecules. Then the reason of the crys-

    talline product change can be understood. Indeed, due

    to the second-order reaction (2), the Cu2   partial pres-

    sure increases with the precursor pressure as its secondpower instead of all other gas partial pressures. Thus,

    since the condensation of Cu2   molecules determines

    the copper particle formation, the relative role of this

    process increases with increasing precursor pressure

    faster when compared to other processes.

    The secondquestionto be discussedis thepossibility

    of copper (I) oxide formation. Because of low reagent

    concentration, the variety of possible pathways can be

    limited by bimolecular reactions. In this case, the only

    way of copper (I) oxide formation is the reaction on the

    surface of a growing oxide particle:

    Cu2 + CO2 ⇔ Cu2O(s)+ CO.   (3)It is obvious that this reaction should be activated.

    Let us propose the physical model of the transition.

    The formation of copper (I) oxide particle occurs if the

    flux of CO2  molecules (with an energy larger than the

    barrier  Eo)   j CO2   on a particle surface is larger than

    the flux of Cu2   molecules   j Cu2 , in the opposite case

    copper particle formation occurs. Thereby, transition

    between the two products might occur due to the vari-

    ation of these two fluxes. At a given temperature of  T 

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    the fluxes may be defined as

    j Cu2 =P Cu2 

    2πmCu2kBT ,

    j CO2

    = P CO2 2πmCO2kBT 

    exp

    − EokBT 

    ,

    (4)

    where  mCu2   and   mCO2   are masses of Cu2   and CO2molecules, respectively, and   kB   is Boltzmann’s con-

    stant. It is obvious that the copper particle growth

    leads to the exhaustion of the copper vapor and to the

    decrease of relative value of  j Cu2  flow. The initial ratio

    of  j Cu2   and  j CO2   flows is more than unity (in case of 

    pure copper formation), but at the end of the precursor

    decomposition this ratio becomes smaller (in case of copper (I) oxide formation). That is why there is a tran-

    sition region instead of the sharp border between the

    different crystalline products. The absence of copper (I)

    oxide (atP prec  >  10 Pa) most likely means that the ratio

    of amount of the oxide to pure copper is less than the

    relative sensitivity  f  of XRD phase identification. In

    this case, at the precursor pressure of P prec = 16 Pa, thecopper (I) oxide particles are formed only at the end of 

    the precursor decomposition, where the  j Cu2 / j CO2   flux

    ratio becomes smaller than unity due to the exhaustion

    of copper vapor and an accumulation of the decompo-

    sition products (carbon dioxide). In order to obtain the

    characteristic value of the precursor pressure where thetransition between products occurs, let us consider the

    final location of the decomposition. The partial pres-

    sure of carbon dioxide can be written as

    P CO2 = 2P prec,   (5)

    where the factor 2 is obtained on the basis of 

    mass-spectrometry results of gaseous decomposition

    products (Tsyganova et al., 1992). The copper vapor

    pressure at the end of the decomposition, when

    copper (I) oxide starts to be formed, can be written by

    taking into account the copper exhaustion and phase

    identification sensitivity f :

    P Cu = fP prec.   (6)

    The partial vapor pressureP Cu2 canbefoundusingequi-

    librium constant Kp of the reaction (2):

    P Cu2 = KpP 2Cu.   (7)

    Combining Eqs. (4)–(7) with the condition j Cu2  =j CO2 , the expression for the boundary precursor

    pressure P ∗prec (the transition pressure of Cu2O productidentification) can be written as

    KpfP ∗

    prec

    2√ mCu2

    =2P ∗

    prec√ mCO2

    exp

    − EokBT 

    .   (8)

    Based on the experimental data of the disappearance

    of copper (I) oxide phase (P ∗prec =   16Pa at   t furn  =

    705.0◦C) andthermodynamic data (Kp = 1.84Pa−1),atthe sensitivity of f  = 0.01, the value of the energy bar-rier for reaction (3) is  Eo =  0.595 eV (57.3 kJ/mole).This value seems to be realistic. Then, it is easy to

    show that the boundary pressure of copper (I) oxide

    formation with mole fraction of less than 0.01 may be

    calculated as

    P ∗prec =const

    Kpexp

    − EokBT 

    ,   (9)

    where const =  3.4 × 104. The semiempirical temper-ature dependence of the boundary pressure obtained

    on the basis of Eq. (9) is presented in Figure 13. The

    area on the diagram above the boundary pressure line

    is related to the region of the absence of copper oxide

    products. As one can see the proposed semiempirical

    phase diagram is in agreement with the experimen-

    tal results of the current work. The boundary pressure

    P ∗prec decreases by decreasing the furnace temperature.That is why at lower temperatures (t furn =   431.5◦C atP prec  =   0.06 to 44 Pa and   t furn  =   596◦C at  P prec  =16–44 Pa) only pure copper particles in the final prod-

    uct of Cu(acac)2   decomposition were obtained. It is

    worth noting that the diagram could be useful for the

    Figure 13. The phase diagram of Cu(acac)2 decomposition crys-

    talline products. Marks ‘’ and ‘’ correspond to the exper-

    imentally determined copper and copper (I) oxide products,

    respectively.

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    Figure 14. The schematic presentation of copper and copper (I)oxide particle formation by the Cu(acac)2  vapor decomposition.

    prediction of the product of the precursor vapor decom-

    position at other experimental conditions. The pro-

    posed approach for the building of the decomposition

    product phase diagram can be used for other experi-

    mental systems with chemical reactions.

    Figure 14 summarizes our viewpoint of the main

    stages occurring inside the furnace at 705.0◦C during

    the precursor decomposition and copper and copper (I)

    oxide particle formation. After the Cu(acac)2   vapor

    evaporation and heating the vapor up to a high enough

    temperature, the formation of copper vapor anddecom-

    position products, as a result of Cu(acac)2  decompo-

    sition reaction, occurs inside the furnace. The next

    important stage is the formation of gaseous copper

    dimers that participate in nucleation and condensa-

    tion processes. Formation of copper (I) oxide particles

    occurs at low precursor vapor pressures due to the sur-

    face reaction of Cu2   vapor and the products of the

    decomposition (mainly, carbon dioxide). The last stage

    is theagglomeration process of theformedprimary par-

    ticles, which exist at the precursor vapor pressure of 

    P prec ≥

    0.1Pa.

    Conclusion

    For this study, a vertical laminar flow reactor has been

    constructed and tested for the investigation of nanopar-

    ticle formation via chemical vapor nucleation. It has

    been shown that crystalline nanometer-size copper and

    copper oxide particles can be produced by thermal

    vapor decomposition of a metal–organic precursor,

    Cu(acac)2, at relatively low temperatures. Individual

    primary particles are formed at the precursor vapor

    pressure of  P prec  <  0.1 Pa. At higher vapor pressures,

    particles form aggregates. At t furn = 431.5◦C, the num-ber mean size of the primary particles increased from

    Dp  =   3.7 nm (with geometric standard deviation of σ g =  1.42) to Dp =  7.2nm (σ g =  1.33) with increas-ing precursor vapor particle pressure from 1.8 to 16 Pa.

    At t furn = 705.0◦C, the primary particle size decreasedfrom  Dp  =   24.0 n m (σ g  =   1.57) to  Dp  =   7.6 nm(σ g = 1.54), respectively.

    At the furnace temperaturesof 431.5◦C and 596.0◦C,only crystalline copper particles were produced. At the

    furnace temperature of  t furn = 705.0◦C, the product of the decomposition reaction depended on the precursor

    vapor pressure: copper particles were formed at vapor

    pressures higher than 10 Pa, copper (I) oxide at pres-

    sures lower than 1 Pa, and a mixture of the metal and

    its oxide at intermediate vapor pressures. For the expla-

    nation of the obtained results, the kinetic restriction on

    copper particle growth was proposed. It leads to the

    mainrole ofa Cu2 molecule participation in the particle

    formation. The formation of copper (I) oxide particles

    occurs due to the surface reaction of the decomposition

    products of which carbon dioxide is the most impor-

    tant. For the explanation of the experimental results,

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    399

    a model is proposed to build a semiempirical phase dia-

    gram of the precursor decomposition crystalline prod-

    ucts. The phase diagram, showing the boundary of the

    appearance of copper (I) oxide, is in agreement with

    the experimental results.

    Acknowledgements

    This work has been supported by TEKES, Finland

    and VTT Chemical Technology via the MATRA

    research program. Mr. P. Räisanen, Dr. M. Ritala and

    Prof. M. Leskelä are gratefully acknowledged for help

    during the XRD analyses and Mr. Timo Hatanpää

    for carrying out TGA analysis. The authors thank 

    Dr. J.K. Jokiniemi, Dr. P.V. Pikhitsa, Dr. V. Mikheevand Prof. T. Ward for fruitful discussions and Dr.

    D.P. Brown for discussions and proofreading the

    manuscript.

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